Key skills:        Packaging, mixed-signal IC

Location:          Cambridge

Duration:           Permanent

The Package Design Engineer’s role involves interacting with subcontractors to design semiconductor packages that interface between the bare silicon die and the product in which they are used.  The role encompasses the design of WLCSP, BGA, LGA and multi-chip module packages. This activity will require working with subcontractors, ASIC design, ASIC layout, Marketing, Applications and Product Engineering groups to achieve the optimum package design. The successful candidate will be responsible for ensuring the manufacturability of products and the smooth transfer of the product from Development to Product Engineering. The candidate will be required to use PCB/IC design tools and manipulate netlists to design and verify package designs. An understanding of semiconductor packaging materials, processes and reliability would be advantageous. The position represents a unique opportunity to assist with the introduction and volume ramp of  Wi-Fi products and the industry’s first single chip Bluetooth family with exposure to RF, analogue, digital and embedded NVM technology in a single CMOS integrated circuit.

They will be responsible for:

• Optimising the package design for performance, manufacturability and market requirements
• Performing formal package design reviews
• Documenting new package designs
• Dissemination of new package designs to the Technical Communications group
• Transferring new package designs into production
• Directing the constructional analysis of assembled packages

Ideally, 3-5 years’ experience in packaging in a high volume, mixed-signal IC production environment. A minimum of a degree in electronics, CAD or a related subject is required.

Please email a word version of your cv quoting Ref. no. 5d03a  together with comments on your suitability for the role and call any time 020 8224 9006

Ref. no. 5d03a